The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Aug. 02, 2018
Applicant:

Sika Technology Ag, Baar, CH;

Inventors:

Dusko Paripovic, Zürich, CH;

Cendrine Ribot, Dietikon, CH;

Assignee:

SIKA TECHNOLOGY AG, Baar, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/10 (2006.01);
U.S. Cl.
CPC ...
C08J 9/0033 (2013.01); C08J 9/103 (2013.01); C08J 2203/04 (2013.01); C08J 2323/08 (2013.01);
Abstract

A thermally expandable composition, including: (a) at least one polymer P, cross-linkable by a free-radical initiator; (b) at least one acrylate A; (c) at least one free-radical initiator; (d) at least one blowing agent; and (e) at least one surfactant, whereby the surfactant is a sulfonate salt. The thermally expandable composition is able to provide sufficient expansion behaviour when used in the form of a thin layer and is especially suitable for baffle and/or reinforcement elements.


Find Patent Forward Citations

Paripovic, Dusko. (2024). Foam with improved expansion behaviour when used in thin layers (U.S. Patent No. 12173132). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12173132

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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