The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

May. 18, 2022
Applicant:

Upbeat Technology Co., Ltd, New Taipei, TW;

Inventors:

Hsien-Lung Ho, New Taipei, TW;

Hsi-Wen Tung, New Taipei, TW;

Assignee:

UPBEAT TECHNOLOGY CO., LTD, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 7/02 (2013.01); B81C 1/00373 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/04 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0156 (2013.01);
Abstract

A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.


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