The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

May. 23, 2023
Applicant:

Ikea Supply Ag, Pratteln, CH;

Inventor:

Dan Pettersson, Ljungby, SE;

Assignee:

IKEA SUPPLY AG, Pratteln, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); A47B 96/20 (2006.01); B27N 3/00 (2006.01); B27N 5/02 (2006.01); B32B 3/18 (2006.01); B32B 7/12 (2006.01); B32B 7/14 (2006.01); B32B 15/10 (2006.01); B32B 21/02 (2006.01); B32B 21/08 (2006.01); B32B 21/13 (2006.01); B32B 21/14 (2006.01); B32B 27/32 (2006.01); B32B 37/12 (2006.01); E04C 2/36 (2006.01); E06B 3/70 (2006.01);
U.S. Cl.
CPC ...
B32B 21/02 (2013.01); A47B 96/205 (2013.01); B27N 3/00 (2013.01); B27N 3/002 (2013.01); B27N 5/02 (2013.01); B32B 3/18 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 15/10 (2013.01); B32B 21/08 (2013.01); B32B 21/13 (2013.01); B32B 21/14 (2013.01); B32B 27/32 (2013.01); B32B 37/1207 (2013.01); E04C 2/36 (2013.01); E06B 3/7015 (2013.01); B32B 2037/1215 (2013.01); B32B 2260/026 (2013.01); B32B 2260/046 (2013.01); B32B 2262/06 (2013.01); B32B 2262/067 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/732 (2013.01); B32B 2479/00 (2013.01); B32B 2607/00 (2013.01); E06B 2003/7021 (2013.01);
Abstract

The present disclosure relates to a hollow boardwith first and second main surface layers. A plurality of distance elements connecting the first and second main surface layers and maintain a predetermined distance there between. The main surface layers include at least a layer of high-density fiber, HDF, board, and a plurality of distance elements are distributed in the space between the main surface layers, and at least some comprise at least one elongate HDF board stripwhich is oriented such that its longitudinal edges interconnect the first and second main surface layers. The HDF boards of the surface layers and of the at least some of the distance elements comprise wood particles bonded by a resin including an isocyanate, such as methylene diphenyl di-isocyanate, MDI.


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