The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 21, 2016
Adeka Corporation, Tokyo, JP;
Naohiro Fujita, Saitama, JP;
Kazuhide Morino, Saitama, JP;
Masato Inadome, Saitama, JP;
Masayoshi Goke, Shizuoka, JP;
Takeshi Sukemune, Shizuoka, JP;
Yosuke Aragane, Shizuoka, JP;
Tomo Kimura, Shizuoka, JP;
Akinori Okubo, Shizuoka, JP;
ADEKA CORPORATION, Tokyo, JP;
Abstract
A molding apparatus reduces waviness or deformation of fibers. The molding apparatus includes a fiber feeder () that feeds fibers () to a lamination area () long in a first direction, a resin composition feeder () that feeds a resin composition () to the lamination area (), an impregnator () that impregnates the fibers () fed to the lamination area () with the resin composition (), a curing accelerator () that accelerates curing of the resin composition () fed to the lamination area () while the fibers () fed in the lamination area () are being tensioned, and a transporter () that relatively moves the devices (, and) in the first direction with respect to the lamination area (). The resin composition () contains an epoxy resin (A), a cyanate resin (B), and an aromatic amine curing agent (C) that is liquid at 25° C.