The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jun. 29, 2022
Applicant:

Vat Holding Ag, Haag, CH;

Inventors:

Simon Naef, Niederteufen, CH;

Lukas Gächter, Gams, CH;

Assignee:

VAT HOLDING AG, Haag, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 11/00 (2006.01); F16K 15/10 (2006.01); F16K 37/00 (2006.01); F16K 51/02 (2006.01);
U.S. Cl.
CPC ...
B23Q 11/0046 (2013.01); F16K 15/10 (2013.01); F16K 37/005 (2013.01); F16K 51/02 (2013.01);
Abstract

Vacuum machining system (), comprising a vacuum chamber () and a vacuum regulating valve (). The vacuum valve () has a first valve seat (), which has a first valve opening () defining a first opening axis (O) and a first sealing surface extending around the first valve opening (O), and a first valve plate () with a first contact surface corresponding to the first sealing surface. The vacuum machining system further comprises a drive unit (), which is designed in such a way and is coupled to the first valve plate () in such a way that the latter can be moved at least from an open position to a closed position and back again. The first valve seat () arranged within the vacuum chamber () and divides the vacuum chamber () into a main process chamber () for machining the substrate and into a secondary process chamber (). The first sealing surface extends orthogonally to the first opening axis (O) and points in the direction of the secondary process chamber (). The first valve plate () is movably arranged in the secondary process chamber ().


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