The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Oct. 23, 2020
Applicant:
Jfe Steel Corporation, Tokyo, JP;
Inventors:
Tomoya Odagaki, Tokyo, JP;
Kohei Furumai, Tokyo, JP;
Norichika Aramaki, Tokyo, JP;
Kohei Ishida, Fukuyama, JP;
Daiki Yanagida, Fukuyama, JP;
Assignee:
JFE STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 11/057 (2006.01); B22D 11/059 (2006.01); B22F 7/08 (2006.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); C22C 19/07 (2006.01);
U.S. Cl.
CPC ...
B22D 11/057 (2013.01); B22D 11/059 (2013.01); B22F 7/08 (2013.01); B22F 10/28 (2021.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C22C 19/07 (2013.01); B22F 2301/15 (2013.01);
Abstract
A method for manufacturing a continuous casting mold in which cracking and spalling are less likely to occur in a filling laminate. The method includes filling a plurality of concave portions formed on an inner surface of a copper-made mold copper plate or a copper alloy-made mold copper plate used for continuously casting steel at least in a region including a meniscus position of molten steel in a casting process with a metal having a thermal conductivity different from that of the mold copper plate.