The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Aug. 23, 2022
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Andreas Ortner, Gau-Algesheim, DE;

Andreas Roters, Mainz, DE;

Hauke Esemann, Woerrstadt, DE;

Markus Heiss-Chouquet, Bischofsheim, DE;

Fabian Wagner, Mainz, DE;

Laura Brueckbauer, Dorn-Duerkheim, DE;

Stephanie Mangold, Klein-Winternheim, DE;

Vanessa Hiller, Mainz, DE;

Assignee:

Schott AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B01L 3/00 (2006.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/364 (2014.01); B23K 26/382 (2014.01); B81B 1/00 (2006.01); C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/0648 (2013.01); B23K 26/0665 (2013.01); B23K 26/364 (2015.10); B23K 26/382 (2015.10); B81B 1/006 (2013.01); B81C 1/00119 (2013.01); C03C 15/00 (2013.01); B01L 2200/12 (2013.01); B81B 2201/051 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/0143 (2013.01); B81C 2203/032 (2013.01);
Abstract

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.


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