The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2024

Filed:

Jul. 24, 2023
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Marc B. Cartier, Jr., Durham, NH (US);

Mark W. Gailus, Concord, MA (US);

Tom Pitten, Merrimack, NH (US);

Donald A. Girard, Jr., Bedford, NH (US);

Huilin Ren, Amherst, NH (US);

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 13/66 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01R 13/6658 (2013.01); H05K 1/117 (2013.01); H05K 1/145 (2013.01);
Abstract

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.


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