The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2024

Filed:

Sep. 09, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Nobuo Ohata, Tokyo, JP;

Keita Mochizuki, Tokyo, JP;

Mizuki Shirao, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 5/08 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H01P 5/08 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/058 (2013.01);
Abstract

A high-frequency circuit is configured so as to include a printed circuit board and a flexible circuit board connected to the printed circuit board, wherein the printed circuit board includes: a first dielectric layer having a first surface and a second surface, a first ground conductor being formed on the first surface; a second dielectric layer having a third surface and a fourth surface, a second ground conductor being formed on the fourth surface; and first signal lines wired between the second surface and the third surface, the flexible circuit board includes: a third dielectric layer having a fifth surface and a sixth surface, a third ground conductor being formed on the fifth surface; a fourth dielectric layer having a seventh surface and an eighth surface, a fourth ground conductor being formed on the eighth surface; and second signal lines wired between the sixth surface and the seventh surface.


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