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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12170160 B1

PDFFull Text
Date of Patent:
Dec. 17, 2024

Filed:

Jan. 26, 2023

Soft magnetic powder, dust core, magnetic element, and electronic device

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Mayu Watanabe, Hachinohe, JP;

Mitsutaka Inui, Fujimi, JP;

Assignee:

SEIKO EPSON CORPORATION, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Adil A Siddiqui

Int. Cl.
CPC ...
C22C 38/02 (2006.01); B22F 1/08 (2022.01); B22F 1/103 (2022.01); B22F 1/142 (2022.01); B22F 3/02 (2006.01); B22F 5/10 (2006.01); B22F 9/04 (2006.01); B22F 9/08 (2006.01); C22C 38/00 (2006.01); C22C 38/12 (2006.01); C22C 38/16 (2006.01); H01F 1/12 (2006.01); H01F 1/14 (2006.01); H01F 1/147 (2006.01); H01F 1/153 (2006.01); H01F 1/20 (2006.01); H01F 1/22 (2006.01); H01F 3/08 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 1/22 (2013.01); H01F 1/12 (2013.01); H01F 1/14 (2013.01); H01F 1/147 (2013.01); H01F 1/14733 (2013.01); H01F 1/15308 (2013.01); H01F 1/15333 (2013.01); H01F 3/08 (2013.01);
Abstract

A soft magnetic powder contains a particle having a composition represented by FeCuNb(SiB), and 0.3≤a≤2.0, 2.0≤b≤4.0, and 75.5≤x≤79.5, and y is a number satisfying f(x)≤y≤0.99, and f(x)=(4×10)x. The particle includes a crystal grain having a grain size of 1 nm to 30 nm, a Cu segregation portion, and a crystal grain boundary. A content proportion of the crystal grain is 30% or more. When the Cu segregation portion positioned in a surface layer portion and having a grain size of 2 nm to 10 nm is referred to as a first Cu segregation portion, and the Cu segregation portion positioned in an inner portion and having a grain size of 2 nm to 7 nm is referred to as a second Cu segregation portion, a number proportion of the first Cu segregation portion is 80% or more, a number proportion of the second Cu segregation portion is 80% or more, and the number of the second Cu segregation portion is twice or more the number of the first Cu segregation portion.

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