The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Aug. 26, 2020
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kyoto University, Kyoto, JP;
The Ritsumeikan Trust, Kyoto, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
KYOTO UNIVERSITY, Kyoto, JP;
THE RITSUMEIKAN TRUST, Kyoto, JP;
Abstract
A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave at an evaluation object including a bonding layer; an elastic wave detection device configured to detect the elastic wave from the evaluation object; and a control device configured to evaluate a parameter related to the bonding layer of the evaluation object. The control device compares an actual value of a frequency characteristic of the elastic wave detected by the elastic wave detection device and a theoretical value of the frequency characteristic of the elastic wave calculated based on a theoretical model related to the evaluation object and evaluates the parameter related to the bonding layer based on a result of the comparison.