The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Dec. 25, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Binti Haridan Fatin Farhanah, Hitachinaka, JP;
Hiroyuki Abe, Hitachinaka, JP;
Takayuki Yogo, Hitachinaka, JP;
Nozomi Yatsumonji, Hitachinaka, JP;
Mizuki Ijuin, Hitachinaka, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ρ of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.