The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Nov. 17, 2021
Korea Institute of Industrial Technology, Cheonan-si, KR;
Dongwoo Fine-chem Co., Ltd., Iksan-si, KR;
Min Hyung Lee, Incheon, KR;
Woon Young Lee, Incheon, KR;
Sang Hoon Jin, Seoul, KR;
Yu Geun Jo, Incheon, KR;
Dong Ryul Lee, Incheon, KR;
Korea Institute of Industrial Technology, Cheonan-si, KR;
Dongwoo Fine-Chem Co., Ltd., Iksan-si, KR;
Abstract
As a tin-silver plating solution that contains a source of tin ions; a source of silver ions (Ag); and an organic additive including a silver (Ag) complexing agent, a tin carrier, and a crystal grain refiner is provided, in the case of performing high-speed plating using the plating solution, the generation of whiskers is diminished, the composition of silver ions (Ag) in the tin-silver plating solution is uniformly maintained, and thus a uniform silver composition in the formed tin-silver solder bumps can be achieved.