The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Apr. 14, 2023
Applicant:
Höganäs Ab (Publ), Höganäs, SE;
Inventors:
Assignee:
HÖGANÄS AB (PUBL), Höganäs, SE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 33/02 (2006.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/06 (2022.01); B22F 1/10 (2022.01); B22F 1/17 (2022.01); B22F 3/16 (2006.01); B22F 3/24 (2006.01); B22F 9/04 (2006.01); C22C 38/16 (2006.01);
U.S. Cl.
CPC ...
C22C 33/0264 (2013.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/06 (2022.01); B22F 1/10 (2022.01); B22F 1/17 (2022.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); B22F 9/04 (2013.01); C22C 33/0235 (2013.01); C22C 38/16 (2013.01); B22F 2003/248 (2013.01); B22F 2301/35 (2013.01); B22F 2302/25 (2013.01); Y10T 428/12014 (2015.01); Y10T 428/12611 (2015.01);
Abstract
A diffusion-bonded powder having an iron powder having 1-5%, preferably 1.5-4% and most preferably 1.5-3.5% by weight of copper particles diffusion bonded to the surfaces of the iron powder particles. The diffusion bonded powder is suitable for producing components having high sintered density and minimum variation in copper content. The iron powder may be produced by providing an atomized iron powder with an oxygen content of 0.3-1.2% by weight and with a carbon content of 0.1-0.5% by weight, and subjecting the atomized iron powder and a copper containing powder to a reduction annealing process in a reducing atmosphere to obtain the iron based powder.