The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Feb. 09, 2021
Triastek Inc., Nanjing, CN;
Peng Wang, Nanjing, CN;
Renjie Li, Nanjing, CN;
Zhengping Jiang, Nanjing, CN;
Feihuang Deng, Nanjing, CN;
Haili Liu, Nanjing, CN;
Senping Cheng, Nanjing, CN;
Xiaoling Li, Dublin, CA (US);
TRIASTEK INC., Nanjing, CN;
Abstract
A high throughput, efficient, and simplified unloading and packaging systems and methods for large-scale production of pharmaceutical units () using additive manufacturing. The systems and methods may unload, inspect, package, and trace pharmaceutical units, produced by an additive manufacturing system (), that are not damaged or deformed. The unloading and packaging system can include one or more unloading and packaging devices (). The unloading and packaging device can include a modular configuration having modules. Individual modules to be arranged in any relative order, at any location, and with any number in the unloading and packaging device. The flexibility of the modular configuration allows one or more modules to be removed or added at any given time due to, e.g., expansion, downsizing, module repair, module upgrades, etc. High throughput can be achieved by operating unloading and packaging devices independently.