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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12167644 B1

PDFFull Text
Date of Patent:
Dec. 10, 2024

Filed:

Mar. 20, 2019

Display device including anisotropic conductive film (acf)

Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventor:

Shinzoh Murakami, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, JP;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H10K 59/12 (2023.01); H01L 25/18 (2023.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H01L 23/00 (2006.01); H10K 50/15 (2023.01); H10K 50/16 (2023.01); H10K 50/17 (2023.01); H10K 50/844 (2023.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01); H10K 59/35 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/124 (2023.02); H01L 25/18 (2013.01); H10K 59/122 (2023.02); H10K 71/00 (2023.02); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06133 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H10K 50/15 (2023.02); H10K 50/16 (2023.02); H10K 50/17 (2023.02); H10K 50/171 (2023.02); H10K 50/844 (2023.02); H10K 59/12 (2023.02); H10K 59/1201 (2023.02); H10K 59/1216 (2023.02); H10K 59/131 (2023.02); H10K 59/352 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

A terminal connection portion, which includes an IC including a plurality of input bumps and a plurality of output bumps, and a terminal connection portion including a plurality of input terminal electrodes and a plurality of output terminal electrodes, is provided in a frame region, and in the terminal connection portion, an electrode insulating film is provided on the input terminal electrodes and the output terminal electrodes. A protruding portion is provided on the electrode insulating film, and the protruding portion overlaps with the IC in a plan view, and overlaps with the input bumps and the output bumps when viewed from a direction parallel to a substrate surface of a resin substrate layer.

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