The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Dec. 25, 2020
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Tinghua Shang, Beijing, CN;

Lulu Yang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 25/18 (2013.01); H01L 27/1288 (2013.01);
Abstract

The array substrate is provided and includes a substrate, a test unit area, first and second flat layers and a terminal area including an input and output terminal areas, the input terminal area includes input terminals for connecting input pins of a driving chip, and the output terminal area includes output terminals for connecting output pins of the driving chip, and each of the input and output terminals includes a second metal layer and a third metal layer disposed on a side of the second metal layer away from the substrate; the second flat layer on a side of the third metal layer away from the substrate and covering edges of the third metal layer; a surface of the first flat layer away from the substrate is not higher than a surface of the second flat layer away from the substrate, in a thickness direction of the substrate.


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