The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Jul. 08, 2021
Applicants:

Rohm Co., Ltd., Kyoto, JP;

Osaka University, Suita, JP;

Inventors:

Masayuki Fujita, Suita, JP;

Daniel Jonathan Headland, Suita, JP;

Tadao Nagatsuma, Suita, JP;

Yosuke Nishida, Kyoto, JP;

Assignees:

ROHM CO., LTD., Kyoto, JP;

OSAKA UNIVERSITY, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 29/66 (2006.01); H01P 3/16 (2006.01); H04B 10/572 (2013.01);
U.S. Cl.
CPC ...
H01L 23/538 (2013.01); H01L 21/76802 (2013.01); H01L 29/66219 (2013.01); H01P 3/16 (2013.01); H04B 10/572 (2013.01);
Abstract

A terahertz module includes: a terahertz chip which includes an active device which emits a terahertz wave; and a dielectric substrate coupled to the terahertz chip. The terahertz chip includes a semiconductor substrate. The active device is disposed on an upper surface of the semiconductor substrate. A cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface. The terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout.


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