The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Dec. 08, 2021
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Kumar Nagarajan, Cupertino, CA (US);
Flynn P. Carson, Redwood City, CA (US);
Karthik Shanmugam, Singapore, SG;
Menglu Li, San Jose, CA (US);
Raymundo M. Camenforte, San Jose, CA (US);
Scott D. Morrison, Austin, TX (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 23/31 (2013.01); H01L 23/53228 (2013.01); H01L 23/5381 (2013.01); H01L 28/00 (2013.01);
Abstract
Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.