The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

May. 30, 2018
Applicant:

Mitsui Chemicals Tohcello, Inc., Tokyo, JP;

Inventor:

Eiji Hayashishita, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/677 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/687 (2013.01); H01L 21/677 (2013.01); H01L 23/12 (2013.01);
Abstract

In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatusincludes a chucking and fixing meansthat chucks and fixes a component holding film to a heated chucking surface, and a preventing meansthat prevents heat convection, occurring on the chucking surface, from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface, and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface, from contacting the film.


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