The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Jan. 29, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Kazuhiro Yoshidome, Tokyo, JP;
Hiroyuki Matsumoto, Tokyo, JP;
Kenji Horino, Tokyo, JP;
Akito Hasegawa, Tokyo, JP;
Syota Goto, Tokyo, JP;
Masakazu Hosono, Tokyo, JP;
Hajime Amano, Tokyo, JP;
Isao Nakahata, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); B22D 23/00 (2006.01); B22F 1/07 (2022.01); C21D 1/26 (2006.01); C21D 1/30 (2006.01); C21D 6/00 (2006.01); C21D 8/12 (2006.01); C21D 9/46 (2006.01); C21D 9/52 (2006.01); C22C 33/02 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/08 (2006.01); C22C 38/10 (2006.01); C22C 38/12 (2006.01); C22C 38/16 (2006.01); C22C 45/00 (2023.01); C22C 45/02 (2006.01); C22C 45/04 (2006.01); H01F 1/153 (2006.01); B22F 9/02 (2006.01); B22F 9/04 (2006.01); C22C 38/40 (2006.01); C22C 38/52 (2006.01);
U.S. Cl.
CPC ...
H01F 1/14733 (2013.01); B22D 23/003 (2013.01); B22F 1/07 (2022.01); C21D 1/26 (2013.01); C21D 1/30 (2013.01); C21D 6/00 (2013.01); C21D 6/001 (2013.01); C21D 6/007 (2013.01); C21D 6/008 (2013.01); C21D 8/1255 (2013.01); C21D 9/46 (2013.01); C21D 9/52 (2013.01); C22C 33/0257 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/02 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/105 (2013.01); C22C 38/12 (2013.01); C22C 38/16 (2013.01); C22C 45/008 (2013.01); C22C 45/02 (2013.01); C22C 45/04 (2013.01); H01F 1/147 (2013.01); H01F 1/14716 (2013.01); H01F 1/14766 (2013.01); H01F 1/14775 (2013.01); H01F 1/14791 (2013.01); H01F 1/15308 (2013.01); H01F 1/15333 (2013.01); B22F 9/023 (2013.01); B22F 2009/048 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C21D 2201/03 (2013.01); C22C 33/0214 (2013.01); C22C 33/0264 (2013.01); C22C 33/0271 (2013.01); C22C 33/0278 (2013.01); C22C 33/0285 (2013.01); C22C 38/40 (2013.01); C22C 38/52 (2013.01); C22C 2200/04 (2013.01); C22C 2202/02 (2013.01);
Abstract
A soft magnetic alloy has a main component of Fe. The soft magnetic alloy contains P. A Fe-rich phase and a Fe-poor phase are contained. An average concentration of P in the Fe-poor phase is 1.5 times or larger than an average concentration of P in the soft magnetic alloy by number of atoms.