The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Sep. 18, 2021
Metal mesh array and manufacturing method thereof, thin film sensor and manufacturing method thereof
Beijing Boe Technology Development Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing BOE Technology Development Co., Ltd., Beijing, CN;
Abstract
The present disclosure provides a metal mesh array and a manufacturing method thereof, a thin film sensor and a manufacturing method thereof, and belongs to the field of electronic device technology. A method for manufacturing a metal mesh array includes: providing a base substrate; forming a first metal layer on the base substrate as a seed layer; forming a first interlayer dielectric layer on a side of the seed layer away from the base substrate such that the first interlayer dielectric layer includes first groove structures and second groove structures in working areas and arranged in an intersecting manner; and performing an electroplating process on the seed layer to form first metal lines in the first groove structures and second metal lines in the second groove structures. The first metal lines and second metal lines in each working area are arranged in an intersecting manner, thereby forming a metal mesh.