The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Nov. 08, 2022
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Shixi Louis Liu, Hooksett, NH (US);

Robert A. Briano, Auburn, NH (US);

Natasha Healey, Manchester, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/20 (2006.01); G01R 19/00 (2006.01); H01L 21/66 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01R 15/20 (2013.01); G01R 19/0092 (2013.01); H01L 22/14 (2013.01); H01L 23/49575 (2013.01);
Abstract

A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.


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