The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Apr. 21, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yeishin Tung, San Jose, CA (US);

Byung Sung Kwak, Portland, OR (US);

Robert Jan Visser, Menlo Park, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 9/021 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01); C23C 14/54 (2006.01); G01B 11/06 (2006.01); H10K 71/16 (2023.01);
U.S. Cl.
CPC ...
G01B 9/021 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01); C23C 14/547 (2013.01); G01B 11/06 (2013.01); H10K 71/166 (2023.02);
Abstract

An organic light-emitting diode (OLED) deposition system has a workpiece transport system configured to position a workpiece within the OLED deposition system under vacuum conditions, a deposition chamber configured to deposit a first layer of organic material onto the workpiece, a metrology system having one or more sensors measure of the workpiece after deposition in the deposition chamber, and a control system to control a deposition of the layer of organic material onto the workpiece. The metrology system includes a digital holographic microscope positioned to receive light from the workpiece and generate a thickness profile measurement of a layer on the workpiece. The control system is configured to adjust processing of a subsequent workpiece at the deposition chamber or adjust processing of the workpiece at a subsequent deposition chamber based on the thickness profile.


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