The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Nov. 29, 2019
Nippon Steel Corporation, Tokyo, JP;
Yuki Suzuki, Tokyo, JP;
Soshi Fujita, Tokyo, JP;
Jun Maki, Tokyo, JP;
Kazuhisa Kusumi, Tokyo, JP;
Masahiro Fuda, Tokyo, JP;
NIPPON STEEL CORPORATION, Tokyo, JP;
Abstract
A plated steel sheet for hot stamping according to one aspect of the present invention includes a steel sheet, a plating layer formed on either surface or both surfaces of the steel sheet and having an Al content of 60 mass % or more, and a surface film layer formed on the plating layer. A thickness t of the plating layer is 10 to 60 μm. An average crystal grain diameter of the plating layer in a thickness range from an interface between the plating layer and the surface film layer to a position at ⅔ of the thickness t is 2t/3 or less and 15.0 μm or less. A surface film layer contains particles containing one or more elements selected from A group elements consisting of Sc, V, Mn, Fe, Co, Ce, Nb, Mo, and W. A total content of the A group elements is 0.01 to 10.0 g/m. An average grain diameter of the particles containing the A group elements is 0.05 to 3.0 μm.