The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Sep. 13, 2019
Applicant:

The Swatch Group Research and Development Ltd, Marin, CH;

Inventors:

Christian Manasterski, Colombier, CH;

Vladislav Spassov, Praz, CH;

Cédric Faure, Cortaillod, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); C22C 5/08 (2006.01); C23C 16/455 (2006.01); C25D 5/00 (2006.01); C25D 5/10 (2006.01);
U.S. Cl.
CPC ...
C23C 16/40 (2013.01); C22C 5/08 (2013.01); C23C 16/403 (2013.01); C23C 16/405 (2013.01); C23C 16/45536 (2013.01); C25D 5/10 (2013.01); C25D 5/623 (2020.08); C25D 5/627 (2020.08);
Abstract

A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of AlOdeposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, and on the first coat of AlO, a second coat of TiOhaving a thickness between 0.5 nm and 100 nm, the substrate including a coat of a silver and copper alloy comprising between 0.1% and 10% by weight of copper with respect to the total weight of the alloy, forming said final silver-plated surface, said coat of a silver and copper alloy having a thickness between 1000 nm and 3000 nm. Embodiments also relate to a method for manufacturing such a substrate.


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