The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Feb. 23, 2022
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Taira Hayakawa, Komaki, JP;

Suguru Kodama, Nagoya, JP;

Hiroaki Noguchi, Sagamihara, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 38/00 (2006.01); B01D 46/00 (2022.01); B01D 46/24 (2006.01); B01D 53/94 (2006.01); B01J 35/56 (2024.01); C04B 38/06 (2006.01);
U.S. Cl.
CPC ...
C04B 38/0009 (2013.01); B01D 46/0001 (2013.01); B01D 46/2448 (2013.01); B01D 46/24491 (2021.08); B01D 46/24492 (2021.08); B01D 46/24494 (2021.08); B01D 53/94 (2013.01); B01J 35/56 (2024.01); C04B 38/0054 (2013.01); C04B 38/0645 (2013.01); B01D 46/249 (2021.08); B01D 2279/30 (2013.01);
Abstract

A porous honeycomb structure including cell channels passing through an interior of the porous honeycomb structure and partitioned by porous partition walls, wherein the porous partition walls include skeleton portions containing an aggregate and a bonding material, and pore portions formed among the skeleton portions and through which a fluid can flow; and the porous partition walls have a porosity of 40 to 48% as measured by a mercury intrusion method, and a cumulative 50% pore diameter (D50) from a large pore side of 6 to 10 μm in a volume-based cumulative distribution of pore diameters measured by the mercury intrusion method, and a maximum pore diameter observed with a scanning electron microscope of 40 μm or less, and a ratio of a contact area between the aggregate and the bonding material to a surface area of the bonding material observed with the scanning electron microscope of 61 to 80%.


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