The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Sep. 17, 2021
Applicant:

Lowe's Companies, Inc., Mooresville, NC (US);

Inventors:

Mansour AbdulBaki, Marietta, GA (US);

Blake Gordon, Atlanta, GA (US);

Assignee:

Lowe's Companies, Inc., Mooresville, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/16 (2006.01); B32B 3/18 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 37/12 (2006.01); B32B 37/20 (2006.01); B32B 38/00 (2006.01); E04F 15/02 (2006.01); E04F 15/10 (2006.01);
U.S. Cl.
CPC ...
B32B 3/16 (2013.01); B32B 3/18 (2013.01); B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/06 (2013.01); B32B 37/12 (2013.01); B32B 37/203 (2013.01); B32B 38/145 (2013.01); E04F 15/0215 (2013.01); E04F 15/107 (2013.01); B32B 2255/10 (2013.01); B32B 2255/102 (2013.01); B32B 2305/022 (2013.01); B32B 2307/54 (2013.01); B32B 2307/542 (2013.01); B32B 2307/546 (2013.01); B32B 2307/748 (2013.01); B32B 2419/04 (2013.01);
Abstract

A device includes a substrate (), a first adhesive (), and a carrier layer (). The substrate has a finish layer (). The substrate has sufficient flexibility to allow manual rolling and to allow manual unrolling without damage. The substrate has a plurality of discontinuous segments (A,B,C). The first adhesive is disposed on an opposing side of the finish layer. The first adhesive is configured for pressure sensitive bonding. The first adhesive has a release characteristic such that the substrate can be bonded and disbonded relative to a substantially planar surface and incur no damage. The carrier layer () is bonded to the finish layer by a second adhesive (). The second adhesive is configured to retain the plurality of discontinuous segments infixed spatial alignment. The second adhesive is configured to cleanly disbond from the finish layer by manual peeling.


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