The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Dec. 23, 2020
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 15/12 (2006.01); B29K 101/12 (2006.01); B29K 307/04 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
B29B 15/12 (2013.01); C08J 5/248 (2021.05); B29K 2101/12 (2013.01); B29K 2307/04 (2013.01); C08J 2361/02 (2013.01); C08J 2361/16 (2013.01); C08J 2461/02 (2013.01); C08J 2461/16 (2013.01);
Abstract
A fiber-reinforced resin prepreg and a molded article obtained by molding a molding material including the fiber-reinforced resin prepreg are described. The fiber-reinforced resin prepreg contains a carbon fiber bundle and a matrix resin composition. The ipa value of the carbon fiber bundle measured by an electrochemical measurement method is 0.14 μA/cmor more. The impact strength of a film obtained by solidifying the matrix resin composition under particular molding conditions is 12.0 kJ/m or more.