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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12162068 B1

PDFFull Text
Date of Patent:
Dec. 10, 2024

Filed:

Aug. 30, 2017

Removing filling material from a cavity in a component and apparatus for performing same

Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventor:

Christoph Kiener, Munich, DE;

Assignee:

SIEMENS AKTIENGESELLSCHAFT, Munich, DE;

Attorney:

Slayden Grubert Beard PLLC

Primary Examiner:

Erin F Bergner

Int. Cl.
CPC ...
B29C 64/35 (2017.01); B08B 5/04 (2006.01); B08B 7/02 (2006.01); B08B 9/00 (2006.01); B22D 29/00 (2006.01); B29C 64/153 (2017.01); B33Y 40/00 (2020.01); B33Y 40/20 (2020.01); B22F 10/28 (2021.01); B22F 10/68 (2021.01); B22F 10/73 (2021.01); B22F 10/80 (2021.01); B22F 12/88 (2021.01);
U.S. Cl.
CPC ...
B22D 29/005 (2013.01); B08B 5/04 (2013.01); B08B 7/02 (2013.01); B08B 7/026 (2013.01); B08B 9/00 (2013.01); B29C 64/153 (2017.08); B29C 64/35 (2017.08); B33Y 40/00 (2014.12); B33Y 40/20 (2020.01); B22F 10/28 (2021.01); B22F 10/68 (2021.01); B22F 10/73 (2021.01); B22F 10/80 (2021.01); B22F 12/88 (2021.01); B22F 2999/00 (2013.01);
Abstract

Various embodiments may include a method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising: holding the component in a movable mounting; moving the component and at the same time removing the filling material through the connection opening; and executing a computer program with a processor, wherein the computer program instructs the processor to: analyze geometry data of the component including the connection opening; and calculate a necessary positioning of the component, based on the geometry data and gravitational force; and direct the movable mounting through a sequence of movements for moving the component in space to spill the filling material from the cavity through the connection opening out of the component.

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