The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
May. 25, 2022
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Genya Tanaka, Shizuoka, JP;
Yasuyuki Sasada, Shizuoka, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H05K 1/0283 (2013.01); H05K 1/0298 (2013.01); H05K 3/101 (2013.01); H05K 3/4652 (2013.01); H05K 1/036 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0141 (2013.01); H05K 2203/1194 (2013.01);
Abstract
A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.