The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Oct. 29, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Patrick Turner, San Bruno, CA (US);

Mike Eddy, Santa Barbara, CA (US);

Andrew Kay, Irvine, CA (US);

Ventsislav Yantchev, Sofia, BG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/58 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H03H 9/02228 (2013.01); H03H 9/02992 (2013.01); H03H 9/105 (2013.01); H03H 9/1085 (2013.01); H03H 9/586 (2013.01); H03H 9/6406 (2013.01);
Abstract

Acoustic resonator devices and filters; and methods of their fabrication are disclosed. A piezoelectric plate is bonded to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity that is formed in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. Walls of an interposer back surface are formed onto the resonator front surface and surround the diaphragm. An interposer cover layer is formed on the walls, spans the walls and creates an enclosed interposer cavity over the diaphragm. A second conductor pattern is formed on the walls and cover layer that includes second contact pads on the interposer back surface; and connections that electrically connect the first contact pads to respective ones of the second contact pads.


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