The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Apr. 20, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Syuhei Miyachi, Kariya, JP;

Atsushi Saitou, Kariya, JP;

Toshihiro Fujita, Kariya, JP;

Noboru Nagase, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02K 9/22 (2006.01); H02K 11/33 (2016.01); B62D 5/04 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 9/22 (2013.01); H05K 1/181 (2013.01); B62D 5/04 (2013.01); H05K 2201/1009 (2013.01);
Abstract

An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.


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