The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Jun. 18, 2020
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Hideyuki Kuboki, Mie, JP;

Hiroomi Hiramitsu, Mie, JP;

Xueqing Dong, Mie, JP;

Masato Tsutsuki, Mie, JP;

Yuto Sato, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/50 (2021.01); G01K 7/22 (2006.01); H01M 10/48 (2006.01); H01M 50/505 (2021.01); H01M 50/519 (2021.01); H01M 50/569 (2021.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H01M 50/569 (2021.01); G01K 7/22 (2013.01); H01M 10/482 (2013.01); H01M 10/486 (2013.01); H01M 50/505 (2021.01); H01M 50/519 (2021.01); H10K 77/111 (2023.02);
Abstract

A wiring module to be attached to a plurality of power storage elements each having an electrode terminal, the wiring module including: a bus bar to be connected to the electrode terminals; and a flexible substrate that is flexible, wherein the bus bar has an extension portion that extends toward the flexible substrate, the extension portion has a through hole, the flexible substrate side of the through hole is closed off by the flexible substrate, the flexible substrate has a first conductive path for detecting the temperature of an object, and the first conductive path is connected to a thermistor, and the thermistor is disposed in the through hole, the through hole is filled with a resin, and the thermistor is covered with the resin.


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