The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
May. 23, 2023
Applicant:
Contemporary Amperex Technology (Hong Kong) Limited, Hong Kong, CN;
Inventors:
Guodong Chen, Ningde, CN;
Yongsheng Guo, Ningde, CN;
Weile Lin, Ningde, CN;
Yandong Wang, Ningde, CN;
Zhaohui Liu, Ningde, CN;
Assignee:
CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED, Hong Kong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0296 (2006.01); C23C 14/35 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02963 (2013.01); C23C 14/35 (2013.01); H01L 31/1828 (2013.01);
Abstract
A method for forming a hole transport layer on a surface of a substrate includes providing M target materials comprising inorganic hole transport materials and forming the hole transport layer on the surface of the substrate using magnetron sputtering. The hold transport layer at least comprises N consecutive sub-layers. M and N are integers and 2≤N≤M. One of the M target materials is a doped target material further comprising a doping material.