The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Jan. 08, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Takeshi Yamazaki, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01B 11/22 (2006.01); G01S 7/10 (2006.01); G01S 7/481 (2006.01); G01S 7/4865 (2020.01); G01S 17/10 (2020.01); G01S 17/894 (2020.01);
U.S. Cl.
CPC ...
H01L 27/14623 (2013.01); G01B 11/22 (2013.01); G01S 7/4814 (2013.01); G01S 7/4816 (2013.01); G01S 7/4865 (2013.01); G01S 17/10 (2013.01); G01S 17/894 (2020.01); H01L 27/14607 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01);
Abstract

There is provided a light-receiving element that includes a semiconductor substrate, a light-shielding film provided on a first surface of the semiconductor substrate and having a lattice form in which openings are arrayed in a matrix form, a plurality of first semiconductor regions arrayed in a matrix form on a second surface opposite to the first surface of the semiconductor substrate, a plurality of second semiconductor regions provided in an adjacent region which is the second surface of the semiconductor substrate and interposes each of the first semiconductor regions in a column direction, and a wiring layer provided on the second surface of the semiconductor substrate and electrically connected to the first semiconductor regions. The first semiconductor region is located in a corresponding region with the light-shielding film and the first surface of the semiconductor substrate interposed therebetween.


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