The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Aug. 26, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jungseok Ryu, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate that includes a bonding pad, a first semiconductor chip disposed on the substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip that is opposite to the substrate, a chip pad disposed on the top surface of the first semiconductor chip, and a bonding wire that connects the chip pad to the bonding pad. The bonding wire includes a first upward protrusion and a second upward protrusion that are convexly curved in a direction away from the substrate. The second semiconductor chip has a first side surface between the first upward protrusion and the second upward protrusion.