The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Jul. 09, 2021
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Sung Chul Joo, Cary, NC (US);
Ulf Hakan Andre, Hillsborough, NC (US);
Assignee:
MACOM Technology Solutions Holdings, Inc., Lowell, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/3142 (2013.01); H01L 23/49586 (2013.01); H01L 23/66 (2013.01); H05K 3/3426 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6644 (2013.01); H05K 1/189 (2013.01);
Abstract
A semiconductor device comprises a lead, a board, and an electrically conductive layer on the board. The lead comprises a longitudinal axis and is soldered to the electrically conductive layer. The semiconductor device further comprises a first solder dam edge and a second solder dam edge, each positioned on the lead not more than 10 mils apart from each other along the longitudinal axis.