The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Mar. 13, 2020
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Inbum Yang, Seoul, KR;

Sangsik Jung, Seoul, KR;

Imdeok Jung, Seoul, KR;

Bongwoon Choi, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H05K 13/02 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67709 (2013.01); H01L 21/67718 (2013.01); H01L 21/67757 (2013.01); H01L 21/67796 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H05K 13/027 (2013.01); H05K 13/046 (2013.01); H05K 13/0478 (2013.01);
Abstract

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.


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