The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

May. 30, 2018
Applicant:

Momentum Dynamics Corporation, Malvern, PA (US);

Inventors:

Bruce Richard Long, Malvern, PA (US);

Andrew W. Daga, Malvern, PA (US);

John M. Wolgemuth, Horsham, PA (US);

Peter C. Schrafel, Philadelphia, PA (US);

Benjamin H. Cohen, Malvern, PA (US);

Moses M. Keener, Philadelphia, PA (US);

Francis J. McMahon, Malvern, PA (US);

Assignee:

InductEV, Inc., King of Prussia, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/36 (2006.01); H01F 27/40 (2006.01); H01F 38/14 (2006.01); H02J 50/12 (2016.01); H01F 27/34 (2006.01);
U.S. Cl.
CPC ...
H01F 38/14 (2013.01); H01F 27/2804 (2013.01); H01F 27/36 (2013.01); H01F 27/363 (2020.08); H01F 27/402 (2013.01); H02J 50/12 (2016.02); H01F 2027/2809 (2013.01); H01F 2027/348 (2013.01);
Abstract

A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.


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