The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Mar. 23, 2021
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Kyotaro Abe, Tokyo, JP;
Takuya Tsukahara, Tokyo, JP;
Isao Nakahata, Tokyo, JP;
Kazuhiro Yoshidome, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 3/04 (2006.01); B22D 11/00 (2006.01); C21D 6/00 (2006.01); C21D 9/56 (2006.01); C22C 1/11 (2023.01); C22C 19/07 (2006.01); C22C 38/02 (2006.01); C22C 45/02 (2006.01); H01F 1/147 (2006.01); H01F 1/153 (2006.01); B82Y 25/00 (2011.01); B82Y 30/00 (2011.01); B82Y 35/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01F 3/04 (2013.01); B22D 11/001 (2013.01); C21D 6/008 (2013.01); C21D 9/563 (2013.01); C22C 1/11 (2023.01); C22C 19/07 (2013.01); C22C 38/02 (2013.01); C22C 45/02 (2013.01); H01F 1/14775 (2013.01); H01F 1/15316 (2013.01); H01F 1/15333 (2013.01); H01F 1/15341 (2013.01); H01F 1/15383 (2013.01); B82Y 25/00 (2013.01); B82Y 30/00 (2013.01); B82Y 35/00 (2013.01); B82Y 40/00 (2013.01); C21D 2201/03 (2013.01);
Abstract
The object of the present invention is to provide an alloy ribbon capable of having excellent adhesiveness between the alloy ribbons when a plurality of the alloy ribbons is stacked; and also, to provide a magnetic core using the alloy ribbon. The present invention is an alloy ribbon comprising metals scattered on at least one surface of the alloy ribbon, in which diameters of the scattered metals are 1 μm or more, and the scattered metals include Cu.