The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Jun. 10, 2022
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Hiromitsu Kuroda, Tokyo, JP;

Tamotsu Sakurai, Tokyo, JP;

Yoshiki Nakade, Hitachi, JP;

Detian Huang, Tokyo, JP;

Xinweilong Li, Tokyo, JP;

Assignee:

PROTERIAL, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 11/18 (2006.01); H01B 13/22 (2006.01);
U.S. Cl.
CPC ...
H01B 11/1821 (2013.01); H01B 13/225 (2013.01);
Abstract

A signal transmission cable includes a conductor, an insulator covering a periphery of the conductor, and a shield layer covering a periphery of the insulator. The shield layer includes a lateral winding shield portion composed of a plurality of metal wires being helically wrapped around the periphery of the insulator to cover the periphery of the insulator, and a batch plating portion composed of a hot dip plating, which is covering a periphery of the lateral winding shield portion. Where a diameter of the metal wire is d and a thickness of the batch plating portion from an outer surface of the metal wire is t, a formula t<0.5d is met over an entire cable circumference. When the signal transmission cable is bent in a U-shape within a range of a bending strain of 35% or less, no cracks occur in the batch plating portion.


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