The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Dec. 15, 2020
Mmi Semiconductor Co., Ltd., Tokyo, JP;
Takashi Kasai, Kyoto, JP;
Hiroaki Sadohara, Kyoto, JP;
Katsuyuki Yamamoto, Kyoto, JP;
Kenta Kajikawa, Kyoto, JP;
MMI SEMICONDUCTOR CO., LTD., Tokyo, JP;
Abstract
A package-type flow sensor includes a flow sensor chip having a sensor part configured to detect a flow of fluid, a package including a flat board part, forming an accommodating chamber configured to accommodate the flow sensor chip, and a connection terminal, provided on an outer surface of the board part, and connected to an external board. Further, in this package-type flow sensor, the board part is provided with a first vent hole communicating to inside and outside of the accommodating chamber, the package is provided with a second vent hole communicating to the inside and the outside of the accommodating chamber, at a position different from the board part, and the flow sensor chip is disposed on a flow passage of the fluid formed by the first vent hole and the second vent hole.