The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Sep. 16, 2020
Nitto Denko Corporation, Ibaraki, JP;
Ihi Inspection and Instrumentation Co., Ltd., Tokyo, JP;
Akiko Tanaka, Ibaraki, JP;
Shigeki Ishiguro, Ibaraki, JP;
Yoshiko Kira, Ibaraki, JP;
Shintaro Fukumoto, Yokohama, JP;
Shun Imagawa, Yokohama, JP;
Takayuki Nishido, Yokohama, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
IHI INSPECTION AND INSTRUMENTATION CO., LTD., Tokyo, JP;
Abstract
The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.