The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Dec. 16, 2019
Applicant:
Seagate Technology Llc, Cupertino, CA (US);
Inventors:
Zubair Ahmed Khan, Villa Park, IL (US);
Sarah R. Marotz, Bloomington, MN (US);
Willis J. Johnson, Eagan, MN (US);
Andrew D. Habermas, Bloomington, MN (US);
Assignee:
Seagate Technology LLC, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/12 (2006.01); B24B 37/11 (2012.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 133/08 (2006.01); H01L 21/02 (2006.01); H01L 21/673 (2006.01); B05D 5/10 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); B24B 37/11 (2013.01); C09J 7/401 (2018.01); C09J 7/405 (2018.01); C09J 133/08 (2013.01); C09J 133/12 (2013.01); H01L 21/02013 (2013.01); H01L 21/673 (2013.01); B05D 5/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/408 (2020.08); Y10T 428/1476 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/2891 (2015.01);
Abstract
The present disclosure relates to methods of forming adhesive films having at least one pressure-sensitive adhesive polymer, related films, and related methods of using such films in lapping processes.