The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

May. 05, 2020
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Xuanhe Zhao, Allston, MA (US);

Hyunwoo Yuk, Cambridge, MA (US);

Akihisa Inoue, Cambridge, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/12 (2006.01); A61L 27/34 (2006.01); A61L 31/10 (2006.01); C08L 75/04 (2006.01); C08L 101/12 (2006.01); C09J 9/00 (2006.01); C09J 175/04 (2006.01); C25D 9/02 (2006.01);
U.S. Cl.
CPC ...
C08J 5/122 (2013.01); A61L 27/34 (2013.01); A61L 31/10 (2013.01); C08J 5/124 (2013.01); C08L 75/04 (2013.01); C08L 101/12 (2013.01); C09J 9/00 (2013.01); C09J 175/04 (2013.01); A61L 2420/02 (2013.01); A61L 2420/08 (2013.01); C08J 2300/208 (2013.01); C25D 9/02 (2013.01);
Abstract

Adhesion of conducting polymers on diverse insulating and conductive substrates via a hydrophilic adhesion layer, where one or more functional groups may be disposed between the substrate and the hydrophilic adhesion layer. Adhesion of the conducting polymers on the substrates is such that adhesion is maintained or substantially maintained in wet physiological environments.


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