The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Dec. 23, 2021
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventors:

Sachiko Murakami, Okazaki, JP;

Kohei Terada, Kiyosu, JP;

Keisuke Nishihara, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41M 5/40 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B41J 15/04 (2006.01);
U.S. Cl.
CPC ...
B41M 5/40 (2013.01); B32B 37/12 (2013.01); B32B 38/145 (2013.01); B41J 15/044 (2013.01); B32B 7/12 (2013.01);
Abstract

A medium includes a heat-sensitive medium and an adhesive medium. The heat-sensitive medium includes a first base material and a first color-developing layer. The first base material has a transparency. The first color-developing layer has a transparency. The first color-developing layer is provided on a first surface of the first base material. The first color-developing layer is configured to become less transparent to develop a first color when heated to a first temperature or higher. The adhesive medium is to be superimposed on and bonded to the heat-sensitive medium in their thickness direction. The adhesive medium includes a second base material and an adhesive layer provided on the second base material. The adhesive medium is to be bonded to the heat-sensitive medium on an opposite side of the first color-developing layer from the first base material. The first base material has one or more images pre-printed thereon.


Find Patent Forward Citations

Loading…