The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Nov. 21, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Chikara Kojima, Matsumoto, JP;

Koji Ohashi, Matsumoto, JP;

Hironori Suzuki, Chino, JP;

Kanechika Kiyose, Matsumoto, JP;

Katsuhiro Imai, Minowa-machi, JP;

Yasuyuki Matsumoto, Azumino, JP;

Takahiro Kamijo, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01); H01L 41/04 (2006.01); H01L 41/08 (2006.01); H10N 30/00 (2023.01); H10N 30/80 (2023.01); H10N 30/87 (2023.01); G01S 15/08 (2006.01);
U.S. Cl.
CPC ...
H10N 30/875 (2023.02); B06B 1/0215 (2013.01); B06B 1/0629 (2013.01); H10N 30/101 (2024.05); H10N 30/802 (2023.02); G01S 15/08 (2013.01);
Abstract

A piezoelectric device includes a substrate having opening portions, a vibrating plate provided to overlap with the substrate and having a plurality of vibrating regions overlapping with the opening portions in a plan view as seen from a thickness direction of the substrate, piezoelectric elements provided in the vibrating regions, and bypass wires provided outside of the vibrating regions of the vibrating plate and electrically coupled to the plurality of piezoelectric elements, wherein slits penetrating the bypass wires in the thickness direction are provided in the bypass wires.


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