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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12156423 B1

PDFFull Text
Date of Patent:
Nov. 26, 2024

Filed:

Aug. 07, 2020

Composite film and manufacturing method thereof, and encapsulation structure including the composite film

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventor:

Li Sun, Beijing, CN;

Assignee:

Beijing BOE Technology Development Co., Ltd., Beijing, CN;

Attorneys:

Nath, Goldberg & Meyer

Joshua B. Goldberg

Primary Examiner:

Amar Movva

Int. Cl.
CPC ...
H10K 50/844 (2023.01); B32B 7/03 (2019.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 33/00 (2006.01); B32B 37/02 (2006.01); B32B 37/24 (2006.01); H10K 50/84 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/8445 (2023.02); B32B 7/03 (2019.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 33/00 (2013.01); B32B 37/02 (2013.01); B32B 37/24 (2013.01); B32B 2037/243 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7265 (2013.01); B32B 2310/0831 (2013.01); B32B 2398/10 (2013.01); B32B 2439/00 (2013.01); B32B 2457/206 (2013.01); H10K 50/841 (2023.02); H10K 71/00 (2023.02);
Abstract

The present invention discloses a composite film, a manufacturing method thereof and an encapsulation structure comprising the composite film. The composite film comprises at least one matrix membrane, each of which comprises at least one waterproof film. In the technical solutions provided by the present invention, the composite film comprises a matrix membrane comprising at least one waterproof film, and therefore, the composite film can be directly disposed on an OLED when the OLED is encapsulated by using the composite film. Accordingly, during an encapsulation process, the used process is simple, the process steps become less, the process time is short, and the required equipment is simpler, so that the production cost is reduced, and the production efficiency is improved.

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