The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

May. 03, 2022
Applicant:

Cgg Services Sas, Massy, FR;

Inventors:

Laurent Clerc, Houston, TX (US);

Jean-Yves Blanc, Longjumeau, FR;

Emilie Lelogeais, Cachan, FR;

Assignee:

CGG Services SAS, Massy, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20236 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20772 (2013.01);
Abstract

A system for cooling an electronic component includes a cylindrical container, a support, a heat exchanger, and one or more micropumps. The cylindrical container includes an internal volume that stores dielectric liquid. The internal volume is formed by an interior wall and a bottom of the cylindrical container. The support is positioned in the internal volume of the cylindrical container, and retains the electronic component within the dielectric liquid stored in the internal volume of the cylindrical container. The support also controls a flow of the dielectric liquid. The heat exchanger is positioned in the cylindrical container and circulates water from an external environment of the cylindrical container into and out of the internal volume of the cylindrical container. The one or more micropumps are integrally formed with and powered by the electronic component, and circulate the dielectric liquid through the electronic component.


Find Patent Forward Citations

Loading…